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Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Analysis, Research Report 2019 With Micron Technology, Inc., SAMSUNG, SK HYNIX INC., Advanced Micro Devices, Inc. And More

This market report defines the market trends and forecast the upcoming opportunities and threats of the hybrid memory cube (HMC) and high-bandwidth memory (HBM market in the next 8 years (Current Year Statistic Will Be Provided in Report). High-bandwidth memory (HBM) market and hybrid memory cube (HMC) are a high-performance ram interface arranged in DRAM memory. HMC is a radical innovation, which sets a new benchmark for power consumption, memory performance, and cost designed for TSV based DRAM memory.

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The report includes market shares of hybrid memory cube (HMC) and high-bandwidth memory (HBM) market for global, Europe, North America, Asia pacific and South America. Some of the major players operating in the global hybrid memory cube (HMC) and high-bandwidth memory (HBM) market are

  • Micron Technology, Inc.
  • SAMSUNG
  • SK HYNIX INC.
  • Advanced Micro Devices, Inc.
  • Intel Corporation
  • XILINX INC.
  • FUJITSU
  • NVIDIA Corporation

Other Players are IBM India Private Limited, Open-Silicon, Inc., Arira Design, Inc., Cadence Design Systems, Inc., Cray Inc., Rambus, Marvell, Arm Limited., among others. The global hybrid memory cube (HMC) and high-bandwidth memory (HBM)market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market.

Owing to increasing developments in supercomputing and advanced networking systems, HMC is o required for a memory efficiency and performance. whereas, high bandwidth memory (HBM) is a high-performance ram interface for 3d-stacked DRAM from AMD and HYNIX. It is to be used in aggregation with high-performance graphics accelerators and network devices. HMC offers advanced bandwidth than HBM. The major application of HMC is its high-performance computing, which leads to the developments in artificial intelligence and machine learning.  When compared with existing memory technologies, HMC can move data 15 times faster than DDR3 module and use 70% less energy and 90% less space.

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Major Market Drivers:

  • Increasing demand for high-bandwidth, low power consuming, and highly scalable memories.
  • Growth in acceptance of artificial intelligence.
  • Electronic devices miniatures are in trend.

Restraints:

  • High levels integration increase thermal issues.

Market Segmentation: Global Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market

  • The global hybrid memory cube (HMC) and high-bandwidth memory (HBM) market is segmented into
  • Memory
  • Product
  • Application
  • Geography
  • Based on memory, the global hybrid memory cube (HMC) and high-bandwidth memory (HBM) market is segmented into hybrid memory cube (HMC) and high-bandwidth memory (HBM)).
  • On the basis of product type, the global hybrid memory cube (HMC) and high-bandwidth memory (HBM) market is segmented into central processing unit, field-programmable gate array, graphics processing unit, application-specific integrated circuit, and accelerated processing unit.
  • On the basis of application, the global hybrid memory cube (HMC) and high-bandwidth memory (HBM) market is segmented into high-performance computing (HPC), networking, data centres, and graphics.
  • Based on geography, the global  hybrid memory cube (HMC) and high-bandwidth memory (HBM) market report covers data points for 28 countries across multiple geographies namely north America & south America, Europe, Asia-Pacific And, Middle East & Africa. Some of the major countries covered in this report are U.S., Canada, Germany, France, U.K., Netherlands, Switzerland, Turkey, Russia, China, India, South Korea, Japan, Australia, Singapore, Saudi Arabia, South Africa and, Brazil among others.

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