Global Interconnects and Passive Components Market Scope, Share, Growth, Overview and Forecast to 2026

Interconnect refers to a connection or cable which can connect two or more devices and create a connection link between two devices either electrically or mechanically. Interconnects are passive electrical components or parts that contains two terminals in their magnetic flux that hold energy. A passive component is a unit without any running energy, with the exception of the available alternating current (AC) circuit with which it is attached. A chassis, inductor, resistor, transformer, or condenser would be a typical passive component.

Different points covered in this report are market overview, competitive analysis, competition by manufacturers, new players, suppliers and vendors, regional output, type and application, volume and shares, sales value and product price, sales revenue and gross margin.

The global interconnects and passive components market accounted for USD 145.3 million growing at a CAGR of 4.5% during the forecast by 2026. The upcoming market report contains data for historic year 2014, 2015, the base year of calculation is 2016 and the forecast by 2026.

Company Share Analysis:

The Interconnects and Passive Components industry report also covers all the regions and countries of the world, which shows a regional development status of Interconnects and Passive Components market, including market size, volume and value, as well as price data. The report for interconnects and passive components market include detailed vendor level analysis for market shares in 2016 for Global, North America, Europe, Asia Pacific, Middle East and Africa and South America specifically. Also impact and development analysis of key vendors is Interconnects and Passive Components in the market and factored on the basis of Vendor Positioning Grid Analysis which measures the vendors strengths and opportunities against present market challenges, measure providers ability to identify or satisfy present market needs, map providers market vision to current and upcoming market dynamics among others. The report also measures technology life line curve and market time line to analyse and do more effective investments.

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Major Market Competitors:

  • TE Connectivity Corporation
  • Amphenol Corporation
  • Molex
  • LLC
  • Delphi Automotive LLP
  • TT Electronics plc
  • Japan Aviation Electronics Industry, Ltd.
  • AVX Corporation
  • Cisco
  • YAZAKI Corporation
  • Panasonic Corporation
  • Inc.
  • Foxconn Electronics Inc

Key points for analysis

  1. To describe and forecast the Global Interconnects and Passive Components Market, in terms of value, by process, product type, and industry.
  2. To strategically profile key players and comprehensively analyze their market position in terms of ranking and core competencies, and detail the competitive landscape for market leaders
  3. Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to products, segmentation and industry verticals.
  4. Company profiling with comprehensive approaches and methodologies, financials, and latest technological developments
  5. To provide detailed information regarding the major factors (drivers, restraints, opportunities, and challenges) influencing the Global Interconnects and Passive Components Market growth

Key points to focus in the report

  • Key trends in the market place
  • Major players and brands
  • Drivers and restrains of the market
  • Major players and brands
  • Historical and current market size and projection up to 2025.

Market Segmentation:

On the basis of geography, global interconnects and passive components market report covers data points for 28 countries across multiple geographies such as North America, South America, Europe, Asia-Pacific, and Middle East & Africa. Some of the major countries covered in this report are U.S., Canada, Germany, France, U.K., Netherlands, Switzerland, Turkey, Russia, China, India, South Korea, Japan, Australia, Singapore, Saudi Arabia, South Africa, and Brazil among others. In 2017, North America is expected to dominate the market.

Type (Passive Components {Resistors, Inductors, Capacitors, Transformers, Diodes}, Interconnects {PCBs, Connectors, Switches, Relays}),

 Application (Consumer Electronics, Data Processing, Telecommunication, Military & Aerospace, Automotive, Industrial, Healthcare)

Major Market Drivers:

  • Increasing demand for consumer electronics
  • Increasing IoT adoption in automotive sector
  • Growing adoption of miniaturized electronic products
  • Technological advancements in M2MCommunication Technology
  • Declining profits margins due to increasing local manufacturers
  • Thermal sensitivity

Research Methodology: Global Interconnects and Passive Components Market

Data collection and base year analysis is done using data collection modules with large sample sizes. The market data is analyzed and forecasted using market statistical and coherent models. Also market share analysis and key trend analysis are the major success factors in the market report. To know more please request an analyst call or can drop down your enquiry.

Some of the key research methodologies used by DBMR Research team is Vendor Positioning Grid, Technology Life Line Curve, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Company Market Share Analysis, Multivariate Modeling, Standards of Measurement, Top to Bottom Analysis and Vendor Share Analysis. To know more about of research skills drop an inquiry to speak to our industry experts.

 Table of Contents

  1. Introduction
  2. Market Segmentation
  3. Market Overview
  4. Executive Summary
  5. Premium Insights
  6. Global, By Component
  7. Product Type


  1. Company Landscape
  2. Company Profiles
  3. Related Reports

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Key Features of the Report

  1. Key developments and product launches by the top players and brands
  2. Key parameters which are driving the market
  3. Key trends of the market
  4. Challenges of market growth
  5. What are the challenges being faced by the new entrants
  6. Market volume
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